• Product
    • 3D AOI

      Perfect combination of 2D and 3D technology

      Edge
    • 3D SPI

      Perfect application of 3D high-precision contour measurement technology

      Mirage
    • FPC AOI

      A unique detection algorithm developed according to the characteristics of the FPC itself

      SF211
    • 2D AOI

      High speed, high precision

      Twins
      LI-6000D
      LI-5000
      LI-3000DP
      MI-3000
      XI-2000
      LD-5000
      MD-2000
      XD-2000
    • LED AOI

      Detection speed reaches 3000mm²/s

      LED-2000
      LED-1000
    • Laser marking equipment

      machine vision technology ensures the accuracy and speed of marking

      LMUV-1000
      Spark-CD
      LMF-2000
      LMC-3000
      SHINE-C1
      SHINE-F1
    • High-speed dispensing equipment

      Proprietary highly integrated induction calibration system

    • Selective wave soldering

      The parameters of each solder joint can be

      VoLcano
    • Optional accessories

      AOI corresponding accessories

      Real-time remote debugging
      Repair terminal
      Centralized management
      SPC
      Three-point comparative analysis
      Bar code
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Product CategoriesLED AOI
LED AOI

Detection speed reaches 3000mm²/s.

Standardized LED automatic optical inspection equipment.

It can perform appearance defect imaging on the front and back of the LED.

  • Dual track fast acquisition
    The equipment adopts full-automatic loading and unloading and double-track quick image acquisition. It is inspected by machine vision and automatically rejects defective LED chips according to the inspection results.
  • Imaging
    Can perform appearance defect imaging on the front and back of the LED
  • protection
    Ion static elimination technology ensures the protection of materials during transmission, imaging, and poor processing
  • Ink mark
    Use imported inkjet equipment to mark the detected appearance defect products with bad ink
  • Connection module
    Connecting module with process equipment after LED packaging process

Use high-speed cylinders to stamp into the waste box for bad processing (optional inkjet marking, Mapping output)

product list
  • LED-2000
    Equipment name: Online automatic Chip LED packaging appearance inspection machine
    Bracket size: 510mm X 460mm (without inkjet device)
    460mm X 350mm (including inkjet device)
    Resolution: 6um ~ 10um (adjustable)
    Dimensions: W1000mm X D1170mm X H1800mm
    Dimensions: W2200 x D1520 x H1750 mm
    Weight: 734KG
  • LED-1000
    Equipment type: online automatic TOP LED packaging appearance inspection machine
    Bracket size: 40mm x 20mm-90mm x 160mm (dual track)
    Bracket thickness: 0.1mm or more
    Resolution: 5μm-12μm (adjustable)
    Dimensions: W2200 x D1520 x H1750 mm
    Weight: 1600KG