• Product
    • 3D AOI

      Perfect combination of 2D and 3D technology

      Edge
    • 3D SPI

      Perfect application of 3D high-precision contour measurement technology

      Mirage
    • FPC AOI

      A unique detection algorithm developed according to the characteristics of the FPC itself

      SF211
    • 2D AOI

      PCBA optical inspection industry benchmark

      Twins
      LI-6000D
      LI-5000
      LI-3000DP
      MI-3000
      XI-2000
      LD-5000
      MD-2000
      XD-2000
    • LED AOI

      The fastest AOI in the industry

      LED-2000
      LED-1000
    • Laser marking equipment

      machine vision technology ensures the accuracy and speed of marking

      Spark-CD
      LMF-2000
      LMC-3000
      SHINE-C1
      SHINE-F1
    • High-speed dispensing equipment

      Proprietary highly integrated induction calibration system

    • Selective wave soldering

      The parameters of each solder joint can be

      VoLcano
    • Optional accessories

      AOI corresponding accessories

      Real-time remote debugging
      Repair terminal
      Centralized management
      SPC
      Three-point comparative analysis
      Bar code
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Product CategoriesLED AOI
LED AOI

The fastest AOI in the industry.

The industry's first standardized LED automatic optical inspection equipment.

It can perform appearance defect imaging on the front and back of the LED.

  • Dual track fast acquisition
    The equipment adopts full-automatic loading and unloading and double-track quick image acquisition. It is inspected by machine vision and automatically rejects defective LED chips according to the inspection results.
  • Imaging
    Can perform appearance defect imaging on the front and back of the LED
  • protection
    Ion static elimination technology ensures the protection of materials during transmission, imaging, and poor processing
  • Ink mark
    Use imported inkjet equipment to mark the detected appearance defect products with bad ink
  • Connection module
    Connecting module with process equipment after LED packaging process

Use high-speed cylinders to stamp into the waste box for bad processing (optional inkjet marking, Mapping output)

product list
  • LED-2000
    Equipment name: Online automatic Chip LED packaging appearance inspection machine
    Bracket size: 510mm X 460mm (without inkjet device)
    460mm X 350mm (including inkjet device)
    Resolution: 6um ~ 10um (adjustable)
    Dimensions: W1000mm X D1170mm X H1800mm
    Dimensions: W2200 x D1520 x H1750 mm
    Weight: 734KG
  • LED-1000
    Equipment type: online automatic TOP LED packaging appearance inspection machine
    Bracket size: 40mm x 20mm-90mm x 160mm (dual track)
    Bracket thickness: 0.1mm or more
    Resolution: 5μm-12μm (adjustable)
    Dimensions: W2200 x D1520 x H1750 mm
    Weight: 1600KG