• Product
    • 3D AOI

      Perfect combination of 2D and 3D technology

      Edge
    • 3D SPI

      Perfect application of 3D high-precision contour measurement technology

      Mirage
    • FPC AOI

      A unique detection algorithm developed according to the characteristics of the FPC itself

      SF211
    • 2D AOI

      PCBA optical inspection industry benchmark

      Twins
      LI-6000D
      LI-5000
      LI-3000DP
      MI-3000
      XI-2000
      LD-5000
      MD-2000
      XD-2000
    • LED AOI

      The fastest AOI in the industry

      LED-2000
      LED-1000
    • Laser marking equipment

      machine vision technology ensures the accuracy and speed of marking

      Spark-CD
      LMF-2000
      LMC-3000
      SHINE-C1
      SHINE-F1
    • High-speed dispensing equipment

      Proprietary highly integrated induction calibration system

    • Selective wave soldering

      The parameters of each solder joint can be

      VoLcano
    • Optional accessories

      AOI corresponding accessories

      Real-time remote debugging
      Repair terminal
      Centralized management
      SPC
      Three-point comparative analysis
      Bar code
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Product Categories3D SPI
3D SPI
Perfect application of 3D high-precision contour measurement technology
  • Dual light source
    Dual light source digital projection detection technology, no shadows, high precision
  • Stop-and-go dynamic acquisition
    Intelligent optimization of inspection route, full-page 3D image display, 100% defect coverage
  • Multi-frequency digital grating projection technology
    The detection range is effectively improved, and the height error of the substrate warping is eliminated through the plane fitting algorithm.
  • SPC system
    The quality trend distribution can be provided graphically, and the defects can be predicted in advance. And find out the potential factors causing the trend in advance, adjust in time, and control the spread of the trend.

All-round three-dimensional solder paste status display of the entire board, which really intuitively reflects the printing defect status of the entire board solder paste

In 3D state, solder paste status display

Missing print, less tin

product list
  • Mirage
    Device type: online automatic 3D SPI
    Special features: 3D high-precision contour measurement technology perfect application
    Applicable substrate: 50mm x 70mm-510mm x 460mm
    Substrate thickness: 0.6mm-6.0mm Resolution: 10μm-15μm (adjustable)
    Height measurement accuracy: 1μm
    Dimensions:W1080 x D1300 x H1850(mm)
    Weight: 740KG