矩子科技

PCBA/FPC defect detection

3D, 2D fully automatic online (offline) AOI. Inspection after printing, inspection after placement, inspection after plug-in, inspection after reflow oven, inspection after wave soldering, etc. SMT surface assembly whole process inspection equipment.

Semiconductor process inspection

3D and 2D inspection of appearance defects in manufacturing process. Detection of wafer surface defects, debris, cracks, cutting cracks, etc.; packaging process (DB, WB) chip defects, poor glue, poor bonding wires, poor solder balls, and debris and other defects.

LED chip packaging inspection

LED lamp bead packaging process fully automatic 2D, 3D appearance inspection, bad sorting, data statistics. Detection of LED chips, soldering, excess glue and less glue, gold wire leakage, debris and dimensional errors.

Smart manufacturing

Complete equipment manufacturing, mechanical structure and electrical design support, sheet metal manufacturing/metal cutting processing, installation and commissioning and on-site service.

Harness components

UL certified power cord, standard interface data transmission cable, signal and electrical connection harness,Various customized interconnection harnesses

3D AOI

3D SPI

2D AOI

Laser marking equipment

High-speed dispensing equipment

Optional accessories